INDUSTRIAL

TD-Q67-12S-01

Industrial PC

GENERAL

This specification defines the requirements for the TD-Q67-12S-01.

KEY FEATURES

  • CPU : Intel® Core i7-3770 [3.4GHz/MAX 3.9GHz]
  • Chipset : Intel® Q67
  • Memory : Samsung DDR3 4G PC3-12800
  • CPU Socket : LGA1155

SPECIFICATION

GENERAL FEATURE
Section Specifications
Form factor SBC Form Factor : Full-size, slot CPU card
Backplane Form Factor : 1x PCIe x16 , 4 PCI-X and 4 PCI slots
System CPU : Intel® Core i7-3770 [3.4GHz/MAX 3.9GHz]
Chipset : Intel® Q67
Memory : Samsung DDR3 4G PC3-12800
CPU Socket : LGA1155
I/O Interface Ethernet : LAN1 - Intel® 82583V PCIe, LAN2 - Intel® 82579 PHY
Digital I/O : 8-bit Digital I/O
Display : 1 x VGA
Audio : Supports by IEI AC-KIT-892HD-R10audio kit
Power consumption 5V@3.98A, 12V@0.38A,Vcore_12V@7.81A,
3.3V@1.61A, 5VSB@0.15A 750W ATX power
Environment Operating Temperature : -10oC ~ 60oC (14°F ~ 140°F)
Humidity : 5% ~ 95%, non-condensing
Storage Samsung 850 PRO 256GB * 2 (RAID SYSTEM)
CPU Cooler STANDARD 1155/1156 SLIM 쿨러
I/O Interface 1 x SMBus
1 x SMBus 4 x Internal RS-232/422/485
1 x VGA
1 x LPT
1 x KB/MS
6 x Internal USB 2.0
1 x Internal RS-422/485
2 x USB 2.0
Conponent ODD : LiteOn DVD-MULTI
Weight 17.4 kg/21 kg(Net/Gross)

DRAWING

TD-H81-2S-01

Industrial PC

GENERAL

This specification defines the requirements for the TD-H81-2S-01.

KEY FEATURES

  • CPU : Intel® Core i3-4160 [3.6GHz]
  • Chipset : Intel® H81
  • Memory : Samsung SO-DIMM DDR3 4G PC3-12800
  • CPU Socket : FCLGA1150

SPECIFICATION

GENERAL FEATURE
Section Specifications
Form factor Motherboard Form Factor : Mini-ITX
System CPU : Intel® Core i3-4160 [3.6GHz]
Chipset : Intel® H81
Memory : Samsung SO-DIMM DDR3 4G PC3-12800
CPU Socket : FCLGA1150
I/O Interface Ethernet : Dual LAN : Intel® 1211-AT PCIe Controller
Digital I/O : 8-bit Digital I/O
Display : 1 x VGA (up to 1920 x 1200 @ 60Hz), 1 x DVI-D (up to 2560 x 1600 @ 60Hz)
Audio : Realyek ALC662 HD Audio codec
Power Supply 1U 250W FLEX ATX Power Supply
Environment Operating Temperature : -10°C ~ 60°C
Humidity : 5% ~ 95%, non-condensing
Storage Samsung 850 PRO 256GB
CPU Cooler CF-1156D : Low Power Cooler
I/O Interface 2 x RS-232 [Pin heder : 3 x RS232 & 1 x RS422/485)
1 x VGA & 1 x DVI-D
1 x LPT
1 x LPT
2 x USB 3.0 & 2 x USB 2.0
2 x SATA 6Gb/s, Dual Gbe LAN Port
Riser Card : 2 x PCI to 1 x PCI-Ex
Conponent ODD : LiteOn DVD-MULTI
Weight 4.5Kg

DRAWING